IBM VTFET and Ru Interconnects: Device and Interconnect Roadmaps

IEDM 2022 showcased progress across advanced logic, memory, interconnect, and heterogeneous packaging from leading manufacturers, research institutes, and universities. Highlights below focus on device architecture (GAA → CFET and beyond), interconnect materials, SRAM concepts, and advanced packaging roadmaps. TSMC N3E FinFlex (Paper 27.5) FinFlex concept. N3E introduces fin depopulation with mixed-height standard cells: a 2-1 library (1-fin stacked over 2-fin),...