IEDM 2024 Highlights: TSMC N2 and Next-Gen SoIC

Overview Semiconductor progress remains a compounding, decades-long march rather than sudden leaps. The International Electron Devices Meeting (IEDM) provides a snapshot of that trajectory across logic devices, memory, and advanced packaging. This year’s highlights included concrete process gains (TSMC N2), credible steps toward CFET integration, renewed interest in compute-in-memory, packaging density advances, and a sober reminder from experts that conventional...