Latest
Arm-Based SoCs: Limits on External GPU, NPU, an...
Overview Qualcomm’s updated counterclaim alleges that Arm is changing its licensing model and engaging in conduct that could restrict how partners source components for Arm-based system-on-chips (SoCs). The filings reference...
Arm-Based SoCs: Limits on External GPU, NPU, an...
Overview Qualcomm’s updated counterclaim alleges that Arm is changing its licensing model and engaging in conduct that could restrict how partners source components for Arm-based system-on-chips (SoCs). The filings reference...
Q3 Results and Outlook for TXN, NVDA, INTC, ASM...
Semiconductor earnings season is revealing critical data points across the supply chain. Even where a subsector seems peripheral, management commentary often reads through to adjacent markets. Where applicable, the direct...
Q3 Results and Outlook for TXN, NVDA, INTC, ASM...
Semiconductor earnings season is revealing critical data points across the supply chain. Even where a subsector seems peripheral, management commentary often reads through to adjacent markets. Where applicable, the direct...
Microsoft, Google, AMD, Nvidia Back Caliptra fo...
Open-source software underpins most of today’s infrastructure, yet production silicon—particularly for consumer and datacenter applications—has had little open-source IP at its core. That is set to change with Caliptra, an...
Microsoft, Google, AMD, Nvidia Back Caliptra fo...
Open-source software underpins most of today’s infrastructure, yet production silicon—particularly for consumer and datacenter applications—has had little open-source IP at its core. That is set to change with Caliptra, an...
Assessing Biren Strategies to Bypass U.S. Sanct...
Background Biren designs advanced AI accelerators using a multi-chip module on TSMC N7 with CoWoS-S packaging. Two products are described: a two-die module (BR100) and a single-die module (BR104). Each...
Assessing Biren Strategies to Bypass U.S. Sanct...
Background Biren designs advanced AI accelerators using a multi-chip module on TSMC N7 with CoWoS-S packaging. Two products are described: a two-die module (BR100) and a single-die module (BR104). Each...
EPYC Genoa Ramp Details and 2023 Datacenter Sha...
Update: Market conditions have weakened materially, and total x86 server CPU units are now expected to decline significantly in 2023. Share gains for AMD remain likely, but earlier volume expectations...
EPYC Genoa Ramp Details and 2023 Datacenter Sha...
Update: Market conditions have weakened materially, and total x86 server CPU units are now expected to decline significantly in 2023. Share gains for AMD remain likely, but earlier volume expectations...
Qualcomm Responds to Arm Lawsuit; Licensing Ter...
Overview A recent counterclaim in the Qualcomm–Arm litigation outlines competing interpretations of long-standing license agreements and reveals new details on royalty structures, scope of rights, and the parties’ conduct after...
Qualcomm Responds to Arm Lawsuit; Licensing Ter...
Overview A recent counterclaim in the Qualcomm–Arm litigation outlines competing interpretations of long-standing license agreements and reveals new details on royalty structures, scope of rights, and the parties’ conduct after...